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Electrodeposited Copper Foil for PCBs Market to Hit USD 497 Million by 2031, Driven by 5G & EV Demand

Global Electrodeposited Copper Foil for Printed Circuit Boards (PCBs) market continues to demonstrate robust growth, with its valuation reaching USD 352 million in 2024. According to comprehensive industry analysis, the market is projected to grow at a CAGR of 5.2%, reaching approximately USD 497 million by 2031.

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Electrodeposited Copper Foil for Printed Circuit Boards Market | Size, Price, import, export, volume 2025 Forecast to 2032

Global electrodeposited copper foil for PCBs market was valued at USD 352 million in 2024 and is projected to reach USD 497 million by 2031, at a CAGR of 5.2% during the forecast period.

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